Company Financials

China Wafer Level CSP Co. Ltd Financials

Renminbi

business China Wafer Level CSP Co. Ltd Company Profile

Main Stock Listing

SSE: 603005

Market Capitalization CN¥18.49 Billion as of Jan. 1, 2026

Market Cap History

Valuations Metrics as of Jan. 3, 2026

Trailing PE 52.19
Forward PE 55.32
Price to Sales TTM CN¥13.20
Price to Book MRQ CN¥3.97
Enterprise to Revenue 11.54
Enterprise to EBITDA 35.77

Financial Reports as of Jun. 30, 2025

Financials

Fiscal Year Ends 2024-12-31
Most Recent Quarter 2025-06-30
Profit Margin 25.04%
Operating Margin 39.82%
Return on Assets TTM 3.73%
Return on Equity TTM 7.66%

Income Statement

Revenue TTM CN¥1,366,222,720
Revenue per Share TTM CN¥2.13
Quarterly Revenue Growth 35.40%
Gross Profit TTM CN¥588,593,664
EBITDA CN¥381,246,132
Net Income to Common TTM CN¥342,045,888
Diluted EPS TTM CN¥0.53
Quarterly Earnings Growth YoY 46.40%

Balance Sheet

Total Cash MRQ CN¥2,557,403,648
Total Cash per Share MRQ CN¥3.93
Total Debt MRQ CN¥
Total Debt to Equity MRQ 6.07
Current Ratio MRQ 5.13
Book Value per Share MRQ CN¥6.96

Cash Flow

Operating Cash Flow TTM CN¥434,119,808
Levered Free Cash Flow TTM CN¥-209,971,344

603005 Stock Info as of Jan. 3, 2026

Stock Statistics

Shares Outstanding 652,171,706
Float Shares 543,268,078
Avg 10 Volume 12,795,365
Avg 30 Volume None
Shares Short None
Short Ratio
Short % of Shares %
% Held by Insiders 1.24%
% Held by Institutions 27.44%

Stock Price Summary

Beta 0.23
Fifty Two Week Low CN¥23.82
Fifty Two Week High CN¥38.20
Fifty Two Week Change 12.40%
Day 50 MA CN¥27.92
Day 200 MA CN¥28.77

Dividends and Splits

Forward Annual Dividend Rate CN¥0.34
Forward Annual Dividend Yield 1.21%
Trailing Annual Dividend Rate CN¥0.08
Trailing Annual Dividend Yield 0.30%
Payout Ratio 15.85%
Dividend Date
Ex Dividend Date 2025-07-04
Last Split Factor
Last Split Date 2022-05-20