Company Financials

China Wafer Level CSP Co. Ltd Financials

Renminbi

business China Wafer Level CSP Co. Ltd Company Profile

Main Stock Listing

SSE: 603005

Market Capitalization CN¥18.14 Billion as of July 1, 2025

Market Cap History

Valuations Metrics as of Jul. 4, 2025

Trailing PE 67.85
Forward PE 55.64
Price to Sales TTM CN¥15.38
Price to Book MRQ CN¥4.17
Enterprise to Revenue 13.63
Enterprise to EBITDA 46.84

Financial Reports as of Mar. 31, 2025

Financials

Fiscal Year Ends 2024-12-31
Most Recent Quarter 2025-03-31
Profit Margin 22.79%
Operating Margin 24.23%
Return on Assets TTM 2.45%
Return on Equity TTM 6.28%

Income Statement

Revenue TTM CN¥1,179,914,752
Revenue per Share TTM CN¥1.79
Quarterly Revenue Growth 20.70%
Gross Profit TTM CN¥462,354,592
EBITDA CN¥345,086,017
Net Income to Common TTM CN¥268,874,944
Diluted EPS TTM CN¥0.41
Quarterly Earnings Growth YoY 32.70%

Balance Sheet

Total Cash MRQ CN¥2,569,273,344
Total Cash per Share MRQ CN¥3.94
Total Debt MRQ CN¥
Total Debt to Equity MRQ 2.77
Current Ratio MRQ 8.22
Book Value per Share MRQ CN¥6.67

Cash Flow

Operating Cash Flow TTM CN¥375,604,512
Levered Free Cash Flow TTM CN¥113,385,040

603005 Stock Info as of Jul. 4, 2025

Stock Statistics

Shares Outstanding 652,171,706
Float Shares 538,942,623
Avg 10 Volume 37,637,308
Avg 30 Volume None
Shares Short None
Short Ratio
Short % of Shares %
% Held by Insiders 1.15%
% Held by Institutions 24.52%

Stock Price Summary

Beta 0.27
Fifty Two Week Low CN¥17.07
Fifty Two Week High CN¥38.20
Fifty Two Week Change 30.93%
Day 50 MA CN¥27.42
Day 200 MA CN¥28.02

Dividends and Splits

Forward Annual Dividend Rate CN¥0.18
Forward Annual Dividend Yield 0.67%
Trailing Annual Dividend Rate CN¥0.05
Trailing Annual Dividend Yield 0.17%
Payout Ratio 11.22%
Dividend Date
Ex Dividend Date 2025-07-04
Last Split Factor
Last Split Date 2022-05-20