Company Financials

China Wafer Level CSP Co. Ltd Financials

Renminbi

business China Wafer Level CSP Co. Ltd Company Profile

Main Stock Listing

SSE: 603005

Market Capitalization CN¥18.88 Billion as of Jan. 1, 2025

Market Cap History

Valuations Metrics as of Jan. 25, 2025

Trailing PE 85.15
Forward PE 57.90
Price to Sales TTM CN¥17.79
Price to Book MRQ CN¥4.67
Enterprise to Revenue 15.93
Enterprise to EBITDA 52.36

Financial Reports as of Sep. 30, 2024

Financials

Fiscal Year Ends 2023-12-31
Most Recent Quarter 2024-09-30
Profit Margin 21.10%
Operating Margin 25.53%
Return on Assets TTM 1.99%
Return on Equity TTM 5.46%

Income Statement

Revenue TTM CN¥1,061,269,312
Revenue per Share TTM CN¥1.61
Quarterly Revenue Growth 47.30%
Gross Profit TTM CN¥437,164,960
EBITDA CN¥285,242,997
Net Income to Common TTM CN¥223,887,008
Diluted EPS TTM CN¥0.34
Quarterly Earnings Growth YoY 118.40%

Balance Sheet

Total Cash MRQ CN¥2,421,925,888
Total Cash per Share MRQ CN¥3.55
Total Debt MRQ CN¥
Total Debt to Equity MRQ 1.69
Current Ratio MRQ 8.28
Book Value per Share MRQ CN¥6.20

Cash Flow

Operating Cash Flow TTM CN¥330,775,552
Levered Free Cash Flow TTM CN¥89,591,816

603005 Stock Info as of Jan. 25, 2025

Stock Statistics

Shares Outstanding 652,172,032
Float Shares 552,738,544
Avg 10 Volume 42,068,840
Avg 30 Volume None
Shares Short None
Short Ratio
Short % of Shares %
% Held by Insiders 1.53%
% Held by Institutions 21.48%

Stock Price Summary

Beta 0.24
Fifty Two Week Low CN¥13.44
Fifty Two Week High CN¥36.77
Fifty Two Week Change 38.83%
Day 50 MA CN¥28.09
Day 200 MA CN¥22.01

Dividends and Splits

Forward Annual Dividend Rate CN¥0.18
Forward Annual Dividend Yield 0.64%
Trailing Annual Dividend Rate CN¥0.05
Trailing Annual Dividend Yield 0.16%
Payout Ratio 13.53%
Dividend Date
Ex Dividend Date 2024-05-24
Last Split Factor
Last Split Date 2022-05-20