Hua Hong Semiconductor Ltd Financials

Market Capitalization HK$50.65 Billion as of Jan. 1, 2025

Valuations Metrics as of Jan. 25, 2025

Trailing PE	86.11
Forward PE	24.73
Price to Sales TTM	HK$26.38
Price to Book MRQ	HK$6.22
Enterprise to Revenue	20.44
Enterprise to EBITDA	113.69

Financial Reports as of Dec. 31, 2023

Financials

Fiscal Year Ends	2023-12-31
Most Recent Quarter	2023-12-31
Profit Margin	6.18%
Operating Margin	-3.31%
Return on Assets TTM	-1.00%
Return on Equity TTM	-0.49%

Income Statement

Revenue TTM	HK$14,954,146,645
Revenue per Share TTM	HK$1.12
Quarterly Revenue Growth	-7.40%
Gross Profit TTM	HK$1,261,032,343
EBITDA	HK$826,769,000
Net Income to Common TTM	HK$924,369,214
Diluted EPS TTM	HK$0.27
Quarterly Earnings Growth YoY	222.60%

Balance Sheet

Total Cash MRQ	HK$44,910,865,970
Total Cash per Share MRQ	HK$3.36
Total Debt MRQ	HK$
Total Debt to Equity MRQ	24.63
Current Ratio MRQ	3.81
Book Value per Share MRQ	HK$3.74

Cash Flow

Operating Cash Flow TTM	HK$2,392,894,453
Levered Free Cash Flow TTM	HK$-4,127,214,177

1347 Stock Info as of Jan. 25, 2025

Stock Statistics

Shares Outstanding	1,309,580,032
Float Shares	781,256,196
Avg 10 Volume	28,010,052
Avg 30 Volume	None
Shares Short	None
Short Ratio
Short % of Shares	%
% Held by Insiders	40.94%
% Held by Institutions	24.82%

Stock Price Summary

Beta	1.28
Fifty Two Week Low	HK$13.80
Fifty Two Week High	HK$32.75
Fifty Two Week Change	33.00%
Day 50 MA	HK$21.14
Day 200 MA	HK$19.81

Dividends and Splits

Forward Annual Dividend Rate	HK$0.17
Forward Annual Dividend Yield	0.74%
Trailing Annual Dividend Rate	HK$0.02
Trailing Annual Dividend Yield	0.09%
Payout Ratio	60.31%
Dividend Date
Ex Dividend Date	2024-06-03
Last Split Factor
Last Split Date