Company
Headquarters: Taipei, Taiwan
TW$300.6 Million
TWD as of Jan. 1, 2024
US$9.8 Million
| Company | Market Cap (USD) |
|---|---|
| Ball Corporation | $17.86 B |
| Packaging Corporation of America | $14.85 B |
| Amcor plc | $14.20 B |
| International Paper Company | $12.45 B |
| Crown Holdings, Inc. | $10.90 B |
SunVic Technology Co., Ltd. engages in the manufacture and sale of EMI shielding laminate and flexible laminated packaging materials in Taiwan. It offers wire and cable materials, including shielding tapes; foil free edge tapes; and polyester, cotton paper, non-woven, and foam polypropylene strips. The company also provides specialized composite films, such as zipper patches; and other films, as well as vacuum-sealed and thermo-forming, and medical packaging bags. In addition, it offers EMI shielding and ESD packaging materials; industrial composite films; and other tapes. The company was formerly known as Taipei Lamination Industries Inc. and changed its name to SunVic Technology Co., Ltd. in April 2007. SunVic Technology Co., Ltd. was founded in 1971 and is headquartered in Taipei, Taiwan.
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SunVic Technology Co. Ltd has the following listings and related stock indices.
Stock: TWSE: 4304 wb_incandescent