Company
Headquarters: Kaohsiung, Taiwan
TW$3.84 Billion
TWD as of Nov. 1, 2021
US$137.7 Million
| Company | Market Cap (USD) |
|---|---|
| Amphenol | $119.17 B |
| Hon Hai Precision Industry Co. Ltd | $77.79 B |
| TE Connectivity Ltd. | $51.42 B |
| Corning Incorporated | $45.15 B |
| Delta Electronics, Inc. | $38.43 B |
ThinFlex Corporation manufactures and sells flexible copper clad laminates (FCCL) and related materials in Asia, Europe, and the Americas. The company offers thin, high heat resistant, high transmittance/transparency, and asymmetric FCCL; black/white/phosphate free coverlays; composite coverlays; high-shield nano materials; composite stiffener films; RCC materials; and polyimide related laminates. It serves IC packaging industry. The company was founded in 2000 and is headquartered in Kaohsiung, Taiwan. ThinFlex Corporation is a subsidiary of Arisawa Mfg. Co., Ltd.
ThinFlex Corp has the following listings and related stock indices.
Stock: TWSE: 3144 wb_incandescent