Company
Headquarters: Tongling, China
Employees: 694
CN¥3.57 Billion
CNY as of Jan. 1, 2024
US$502.8 Million
| Company | Market Cap (USD) |
|---|---|
| Siemens | $138.51 B |
| General Electric | $135.68 B |
| Honeywell | $135.08 B |
| Schneider Electric SE | $110.11 B |
| Open Joint Stock Company OMZ | $101.93 B |
| Company | Market Cap (USD) |
|---|---|
| Boeing | $148.18 B |
| Union Pacific | $147.34 B |
| Caterpillar | $145.65 B |
| Siemens | $138.51 B |
| General Electric | $135.68 B |
WenYi Trinity Technology Co., Ltd designs, manufactures, and sells semiconductor plastic packaging molds and equipment in China and internationally. The company offers chemical building materials, extrusion molds, precision hardware parts, plastic packaging presses, chip packaging machines, human integration systems, automatic packaging systems, and precision spare parts; semiconductor integrated circuit packaging molds, and automatic cutting and forming systems; and sorting machines, plastic packaging presses, automatic packaging systems, chip packaging robot integrated systems, LED dispensers, semiconductor precision spare parts, etc. It also provides auto parts, metal stamping parts, and injection molding products; plastic doors and windows; and color aluminum doors and windows. The company was formerly knowns as Tongling Zhongfa Sanjia Technology Co., Ltd. and changed its name to WenYi Trinity Technology Co., Ltd in 2011. WenYi Trinity Technology Co., Ltd was founded in 2000 and is based in Tongling, the People's Republic of China.
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WenYi Trinity Technology Co. Ltd has the following listings and related stock indices.
Stock: SSE: 600520 wb_incandescent