Company
Headquarters: Hsinchu City, Taiwan
TW$12.41 Billion
TWD as of Jan. 1, 2024
US$404.6 Million
Winstek Semiconductor Co., Ltd. engages in the research, development, and testing of integrated circuits in Taiwan. The company operates through two segments, Testing and Packaging. It offers wafer sort, final and post-test, engineering support, and test platforms services; copper pillar bump, wafer level chip scale package, lead free bump, plating bump/ball drop/RDL, 6S protection, and backside metallization services; die processing, wafer thinning, singulation, and flip chip services; and failure analysis and reliability testing services. The company was formerly known as Stats ChipPac Taiwan Semiconductor Corp. and changed its name to Winstek Semiconductor Co., Ltd. in June 2015. The company was founded in 2000 and is headquartered in Hsinchu, Taiwan. Winstek Semiconductor Co., Ltd. is a subsidiary of Ge-Shing Corporation.
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Winstek Semiconductor Co. Ltd has the following listings and related stock indices.
Stock: TWSE: 3265 wb_incandescent