Company
Headquarters: Kyoto, Japan
Employees: 1,633
CEO: Mr. Hirokazu Okada
¥115.73 Billion
JPY as of Jan. 1, 2025
US$737.6 Million
TOWA Corporation designs, develops, manufactures, and sells semiconductor manufacturing equipment and high-precision molds in Japan and internationally. Its products include molding equipment, singulation equipment, ultra-precision molds, THPL-CBN end mills, and TEN-systems; and semiconductor encapsulating and laser processing equipment, as well as fine plastic molded products. The company also offers manufacturing systems for electronic components, precision-molded and assembly products, medical-use equipment, and precision machining tools. In addition, it sells used equipment. The company was formerly known as TOWA Precision Industries Limited and changed its name to TOWA Corporation in December 1988. TOWA Corporation was incorporated in 1979 and is headquartered in Kyoto, Japan.
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| Last Financial Reports Date | March 31, 2024 |
| Revenue TTM | ¥56.60 B |
| EBITDA | ¥9.18 B |
| Gross Profit TTM | ¥18.20 B |
| Profit Margin | 14.68% |
| Operating Margin | 21.61% |
| Quarterly Revenue Growth | 20.30% |
TOWA Corp has the following listings and related stock indices.
Stock: JPX: 6315 wb_incandescent
Stock: FSX: TWA wb_incandescent