Company

3s Silicon Tech., Inc.

Headquarters: Hsinchu, Taiwan

TWSE: 5297 -2.82%

Market Cap

TW$557.3 Million

TWD as of Jan. 1, 2024

US$18.2 Million

Market Cap History

3s Silicon Tech., Inc. market capitalization over time

Evolution of 3s Silicon Tech., Inc. market cap in the past 5 years

Market capitalizations are calculated from the opening stock price at the beginning of each month.

Market Cap History of 3s Silicon Tech., Inc.

Detailed Description

3s Silicon Tech., Inc. provides die bonding in discrete power devices in Taiwan and internationally. It offers clip die bonder for power devices, such as clip die bonder, clip attach, and pick and place; snap ovens, including normal snap oven, snap oven with vacuum reflow process, formic acid reflow oven, power module assembly automation solution, and flux eutectic reflow oven; customized equipment comprising power device assembly automation solution and power discrete assembly automation solutions; and open lab platform, such as product and fabrication process verification. The company was founded in 1998 and is based in Hsinchu, Taiwan.

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Stocks & Indices

3s Silicon Tech., Inc. has the following listings and related stock indices.


Stock: TWSE: 5297 wb_incandescent

Details

Headquarters:

No.169-2, Sec. 1

2nd Floor Kangle Road Xinfeng Township

Hsinchu, 304

Taiwan

Phone: 886 3 557 7668

Fax: 886 3 557 7658