Company

Chipbond Technology Corp

Headquarters: Hsinchu City, Taiwan

CEO: Mr. Fei-Jain Wu

TWSE: 6147 +0.18%

Market Cap

TW$40.95 Billion

TWD as of July 1, 2025

US$1.40 Billion

Market Cap History

Chipbond Technology Corp market capitalization over time

Evolution of Chipbond Technology Corp market cap in the past 5 years

Market capitalizations are calculated from the opening stock price at the beginning of each month.

Market Cap History of Chipbond Technology Corp

Detailed Description

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan.

Financials

Last Financial Reports Date March 31, 2025
Revenue TTM TW$21.20 B
EBITDA TW$7.56 B
Gross Profit TTM TW$5.09 B
Profit Margin 16.87%
Operating Margin 13.74%
Quarterly Revenue Growth 20.00%
Financial Reports & Statistics

Stocks & Indices

Chipbond Technology Corp has the following listings and related stock indices.


Stock: TWSE: 6147 wb_incandescent

Details

Headquarters:

No. 3, Lising 5 Road

Hsinchu Science Park

Hsinchu City, 300

Taiwan

Phone: 886 3 567 8788

Fax: 886 3 563 8998