Integrated Service Technology, Inc.

Detailed Description

Integrated Service Technology Inc. provides IC circuit debugging, and verification and analysis services to the IC engineering industry in Taiwan and internationally. It offers mass production services consisting of MOSFET wafer backend processes, such as chemical/electro-less plating and front-side metal sputtering deposition; MOSFET backside grinding processes, including wafer thinning/non-taiko grinding/conventional grinding; MOSFET backside metallization processes comprising metal evaporation deposition and thick Ag process; and turnkey solutions for backend processes, which include chip probing, laser marking, vacuum mounting, ring removal, die sawing, frame probing, tape and reel solutions, and final test. The company also provides verification analysis services, such as focused ion beam (FIB) circuit edit, IC decapsulation and delayer, cross-section and backside polish, CAD probe pad, and wafer-level chip scale package circuit edit solutions; engineering sample preparation services, including wafer dicing saw; die bonding; and IC wire bonding/assembly solutions; surface mount technology process; failure analysis that include electrical characteristics measurement, non-destructive analysis, sample preparation, defect detection, and competitive analysis services; and connectivity test, certification, and design quality management services. In addition, it offers material analysis solutions comprising sample preparation, structure observation, surface, thermal, and component analysis services; reliability design test, including component reliability test, board level reliability test, PCB design verification, automotive electronics test, warpage verification, and other services; and chemical and physical material analysis, and consultancy/system establishment services. The company was founded in 1994 and is based in Hsinchu City, Taiwan.