Company

Taiwan IC Packaging Corp

Headquarters: Kaohsiung, Taiwan

Employees: 537

TWSE: 3372 +1.11%

Market Cap

TW$2.78 Billion

TWD as of Jan. 1, 2025

US$84.7 Million

Market Cap History

Taiwan IC Packaging Corp Categories

Taiwan Technology Semiconductors
Taiwan Technology Taiwan Semiconductors

Taiwan IC Packaging Corp market capitalization over time

Evolution of Taiwan IC Packaging Corp market cap in the past 5 years

Market capitalizations are calculated from the opening stock price at the beginning of each month.

Market Cap History of Taiwan IC Packaging Corp

Top Competitors by Market Capitalization

Industry: Semiconductors
Company Market Cap (USD)
Nvidia $3.605 T
Broadcom $1.126 T
TSMC $896.76 B
AMD $199.67 B
Qualcomm $193.71 B
Sector:
Company Market Cap (USD)
Nvidia $3.605 T
Apple $3.363 T
Microsoft $3.321 T
Broadcom $1.126 T
TSMC $896.76 B

Detailed Description

Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. Its products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. The company also offers substrate-based package, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is based in Kaohsiung, Taiwan.

Stocks & Indices

Taiwan IC Packaging Corp has the following listings and related stock indices.


Stock: TWSE: 3372 wb_incandescent

Details

Headquarters:

Kaohsiung Export Processing Zone

South Road One

Kaohsiung, 806

Taiwan

Phone: 886 7 815 8800

Fax: 886 7 815 9456