Company
Headquarters: Kaohsiung, Taiwan
Employees: 537
TW$2.51 Billion
TWD as of Jan. 1, 2024
US$81.7 Million
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. Its products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. The company also offers substrate-based package, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is based in Kaohsiung, Taiwan.
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Taiwan IC Packaging Corp has the following listings and related stock indices.
Stock: TWSE: 3372 wb_incandescent