Xintec, Inc.

Detailed Description

Xintec Inc. operates as a three dimensional (3D) wafer level chip scale packaging company in Taiwan, the United States, Europe, and Asia. The company offers optical sensor chip-scale package technology for cellular phones, notebooks, gesture sensors, and laser intensity sensor for blue-ray and pico projectors; PPI and 3D Package technologies for use in integrated passive devices, power management IC and analogue IC, cellular phone RF IC, and capacitive couplers; and Micro-Electro-Mechanical Systems (MEMS) and sensor packaging for ink printer heads, motion sensors, temperature and humidity sensors, pressure sensors, identification sensors, pico-projector heads, silicon microphones, and bio sensors. It also provides design and modeling services for its technologies. Xintec Inc. was founded in 1998 and is headquartered in Taoyuan, Taiwan.