Company
Headquarters: Taoyuan City, Taiwan
Employees: 1,592
TW$56.58 Billion
TWD as of Jan. 1, 2025
US$1.72 Billion
Xintec Inc. operates as a three dimensional (3D) wafer level chip scale packaging company in Taiwan, the United States, Europe, and Asia. The company offers optical sensor chip-scale package technology for cellular phones, notebooks, gesture sensors, and laser intensity sensor for blue-ray and pico projectors; PPI and 3D Package technologies for use in integrated passive devices, power management IC and analogue IC, cellular phone RF IC, and capacitive couplers; and Micro-Electro-Mechanical Systems (MEMS) and sensor packaging for ink printer heads, motion sensors, temperature and humidity sensors, pressure sensors, identification sensors, pico-projector heads, silicon microphones, and bio sensors. It also provides design and modeling services for its technologies. Xintec Inc. was founded in 1998 and is headquartered in Taoyuan, Taiwan.
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| Last Financial Reports Date | Sept. 30, 2024 |
| Revenue TTM | TW$6.75 B |
| EBITDA | TW$2.67 B |
| Gross Profit TTM | TW$2.18 B |
| Profit Margin | 23.69% |
| Operating Margin | 24.00% |
| Quarterly Revenue Growth | 16.60% |
Xintec, Inc. has the following listings and related stock indices.
Stock: TWSE: 3374 wb_incandescent